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Electropastes


-cold and/or thermo curing 2-pack casting resins enriched with specific fillers with good thermal conductivity, partly of liquid and partly of mastic-like consistency
-solvent-free, thus no attack of solvent-sensitive plastics, no unpleasant odour caused by solvents
-excellent resistance to numerous chemicals, acids, oils, solvents, moisture and water
-outstanding adhesion
-very good dielectric properties
-high mechanical strength and resistance
-very good thermal conductivity
-for use in the electronics, electrotechnology and electrical engineering industries to seal and pot electronic components and all types of coils that can be subjected to the comparatively low heat generation and shrinkage pressure for epoxy resin systems

EP 8000
Base: Epoxy resin (EP)

Brown
Cure at room temperature
Excellent adhesive strength
High mechanical and chemical resistance
High thermal ageing resistance
Solvent-free
Very good thermal conductivity


EP 8100
Base: Epoxy resin (EP)

Excellent adhesion
Excellent heat conductivity
High mechanical and chemical resistance
High thermal ageing resistance
Thermal class F = 155ºC (311º F)
Thermal curing (curing possible at 70º C (158º F))